Core pain points: Precision electronic components (such as BGA chips, ceramic capacitors, quartz crystals) and assemblies (such as connectors with pins) are highly susceptible to damage, cracking, desolder or pin deformation due to shock, vibration during transportation or handling.

Refined cushioning design: More precise cushioning materials (such as customized foam materials, air column bags) and structural design are required to ensure sufficient and uniform support and energy absorption under severe logistics conditions (especially multimodal transportation) to avoid local stress concentration.

Micro-vibration protection: High-frequency micro-vibrations can lead to fatigue fracture of solder joints, requiring special vibration dampening designs.

High cost of packaging verification: Packaging testing to more stringent ISTA or ASTM standards, especially test procedures that simulate car transportation, requires high verification costs.

Core pain points: Many electronic components, especially IC chips, are humidity-sensitive devices (MSDs) that absorb moisture when exposed to air. High temperatures during welding can cause a "popcorn effect" (internal cracking) if not properly dried before reflow soldering or if the packaging is broken and becomes damp.

High-grade moisture-resistant packaging: Moisture-resistant bags (such as aluminum foil composite bags) with high-efficiency desiccant and humidity indicator card (HIC) are required.

Tight sealing: The sealing of moisture-proof bags must be absolutely reliable, ensuring that the internal low-humidity environment is maintained for the specified shelf life (according to MSD ratings).

Timeliness control after unpacking: Once unpacked, welding must be completed within the specified time (such as a few hours), otherwise it needs to be re-baked and dried. This places high demands on production planning and packaging marking.

Packaging process environment control: The packaging operating environment (temperature and humidity) needs to be controlled to avoid moisture entering during packaging.

Core pain points: Contaminants such as dust, fibers, and metal debris can cause short circuits, poor contact, or affect the performance of optical components (cameras, lidar).

Packaging materials are clean: packaging materials (especially liners and cushioners) should not produce dust, chip or release volatile organic compounds (VOCs).

Clean packaging environment: The packaging process needs to be carried out in an environment with controlled cleanliness.

Cleaning challenges for recyclable packaging: Recyclable packaging (e.g., totes, pallets) for electronic components has extremely high cleaning standards, requiring specialized cleaning equipment and processes to ensure no residual contaminants and static control materials without degradation. High cleaning costs and complex management.

Core pain points: Some sensitive electronic components (or parts in strong electromagnetic environments) may need to be protected from external electromagnetic interference or self-interference during transportation and storage.

Packaging and handling challenges due to miniaturization and high density:

Core pain points: Electronic components are often small in size, light in weight but high in value, and finely structured.

Loss Prevention: Small items are easy to shift, drop, or lose within the package. It is necessary to design a sophisticated internal partition and fixed structure.

Pick-and-place efficiency and damage prevention: How to quickly and non-destructively remove tiny or delicate electronic parts (e.g., connectors with gold fingers, micro sensors) is a big challenge. Packaging design needs to consider ease of access (e.g., blister box design).

Package Size Optimization: Provide adequate protection without wasting space and increasing costs due to overpackaging. High requirements are put forward for the secondary packaging design of small parts (such as reels, tubes, pallets).